Proceedings 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, the Adam's Mark Hotel, Denver, Colorado

http://www.w3.org/1999/02/22-rdf-syntax-ns#type

http://schema.org/Book
http://schema.org/CreativeWork

http://schema.org/about

http://experiment.worldcat.org/entity/work/data/1151750166#Topic/encapsulation_electronique_congres
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/boitier_multipuce_microelectronique_congres
http://id.loc.gov/authorities/subjects/sh2008107750
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/mise_sous_boitier_electronique
http://id.loc.gov/authorities/subjects/sh92002333
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/microelectronic_packaging_congresses
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/modules_multipuces_microelectronique_congres
http://id.worldcat.org/fast/1019751
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/mise_sous_boitier_electronique_congres
http://id.worldcat.org/fast/1028806
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/boitier_multipuce_microelectronique
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/multichiptechnik
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/kongress
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/multichip_modules_microelectronics_congresses
http://experiment.worldcat.org/entity/work/data/1151750166#Topic/platzierung_mikroelektronik

http://schema.org/alternateName

"Multichip modules and high density packaging"
"Multichip modules and high density packaging"@en
"Multichip Modules and High Density Packaging, 1998, proceedings, 1998 7th International Conference on"@en
"MCM 98"

http://schema.org/contributor

http://viaf.org/viaf/123926298
http://id.loc.gov/authorities/names/nr94012200
http://viaf.org/viaf/148621305
http://id.loc.gov/authorities/names/n79053217
http://viaf.org/viaf/133344872
http://id.loc.gov/authorities/names/no97025808

http://schema.org/creator

http://experiment.worldcat.org/entity/work/data/1151750166#Meeting/international_conference_on_multichip_modules_and_high_density_packaging_1998_denver_colo
http://experiment.worldcat.org/entity/work/data/1151750166#Organization/international_conference_on_multichip_modules_and_high_density_packaging_&lt_1998_denver_colo_&gt
http://experiment.worldcat.org/entity/work/data/1151750166#Meeting/international_conference_on_multichip_modules_and_high_density_packaging_7_1998_denver_colo

http://schema.org/genre

"Ressource Internet (Descripteur de forme)"
"Denver (Colo., 1998)"
"Conference papers and proceedings"
"Conference papers and proceedings"@en
"Kongress"

http://schema.org/name

"Proceedings 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, the Adam's Mark Hotel, Denver, Colorado"@en
"Proceedings / 1998 International Conference on Multichip Modules and High Density Packaging : April 15 - 17, 1998, the Adam's Mark Hotel, Denver, Colorado"
"Proceedings : 1998 International Conference on Multichip Modules and High Density Packaging, April 15-17, 1998, the Adam's Mark Hotel, Denver, Colorado"
"1998 International Conference on Multichip Modules and High Density Packaging Proceedings : April 15-17, 1998, the Adam's Mark Hotel, Denver, Colorado"
"Proceedings"

http://schema.org/workExample

http://www.worldcat.org/oclc/39914256
http://www.worldcat.org/oclc/423981879
http://www.worldcat.org/oclc/312977037
http://www.worldcat.org/oclc/758881787
http://www.worldcat.org/oclc/47875589

International Conference on Multichip Modules and High Density Packaging (1998 : Denver, Colo.)

This is a placeholder reference for a Meeting entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.

rdf:type
http://schema.org/Event
http://www.productontology.org/id/Meeting
schema:name
"International Conference on Multichip Modules and High Density Packaging (1998 : Denver, Colo.)"

http://experiment.worldcat.org/entity/work/data/1151750166#Meeting/international_conference_on_multichip_modules_and_high_density_packaging_1998_denver_colo

International Conference on Multichip Modules and High Density Packaging (7 ; 1998 ; Denver, Colo.).

rdf:type
http://schema.org/Event
http://www.productontology.org/id/Meeting
schema:name
"International Conference on Multichip Modules and High Density Packaging (7 ; 1998 ; Denver, Colo.)."

http://experiment.worldcat.org/entity/work/data/1151750166#Meeting/international_conference_on_multichip_modules_and_high_density_packaging_7_1998_denver_colo

International Conference on Multichip Modules and High Density Packaging. <1998, Denver, Colo.>.

This is a placeholder reference for a Organization entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.

rdf:type
http://schema.org/Organization
schema:name
"International Conference on Multichip Modules and High Density Packaging. <1998, Denver, Colo.>."

http://experiment.worldcat.org/entity/work/data/1151750166#Organization/international_conference_on_multichip_modules_and_high_density_packaging_&lt_1998_denver_colo_&gt

Boîtier multipuce (Microélectronique)

This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.

rdf:type
http://schema.org/Topic
schema:name
"Boîtier multipuce (Microélectronique)"