Linked Data Explorerhttp://worldcat.org/entity/work/id/1152966691
Electronic and photonics packaging multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA
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- http://id.worldcat.org/fast/907414
- http://id.worldcat.org/fast/1019745
- http://id.loc.gov/authorities/subjects/sh2008109257
- http://id.worldcat.org/fast/1032639
- http://id.loc.gov/authorities/subjects/sh2008107750
- http://id.loc.gov/authorities/subjects/sh2005005546
- http://id.worldcat.org/fast/975620
- http://id.loc.gov/authorities/subjects/sh88006576
- http://id.worldcat.org/fast/1139228
- http://id.loc.gov/authorities/subjects/sh2008108196
- http://id.loc.gov/authorities/subjects/sh2008107748
- http://id.loc.gov/authorities/subjects/sh2008102949
- http://id.worldcat.org/fast/1019751
- http://id.loc.gov/authorities/subjects/sh88004308
- http://id.loc.gov/authorities/subjects/sh85042388
- http://id.worldcat.org/fast/1741364
- http://id.worldcat.org/fast/1062073
http://schema.org/contributor
- http://viaf.org/viaf/134753433
- http://experiment.worldcat.org/entity/work/data/1152966691#Meeting/imece_2006_2006_11_05_10_chicago_ill
- http://experiment.worldcat.org/entity/work/data/1152966691#Meeting/asme_international_mechanical_engineering_congress_and_exposition_2006_11_05_10_chicago_ill
- http://id.loc.gov/authorities/names/nr2001047614
http://schema.org/name
- "Electronic and photonics packaging multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA"@en
- "Electronic and photonics packaging, multi-scale electrical and mechanical systems - 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5 - 10, 2006, Chicago, Illinois, USA"
- "Electronic and photonics packaging : multi-scale electrical and mechanical systems : 2006 : presented at 2006 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2006, Chicago, Illinois, USA"@en