Linked Data Explorerhttp://worldcat.org/entity/work/id/30494025
Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler
Open All Close All
http://schema.org/contributor
- http://viaf.org/viaf/127889356
- http://id.loc.gov/authorities/names/n88112126
- http://worldcat.org/entity/person/id/2630496757
- http://viaf.org/viaf/131110795
- http://worldcat.org/entity/person/id/2634143695
- http://viaf.org/viaf/156070428
- http://worldcat.org/entity/person/id/2666709091
- http://id.loc.gov/authorities/names/n84053263
- http://id.loc.gov/authorities/names/n90699600
- http://worldcat.org/entity/person/id/2629268346
http://schema.org/name
- "Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler"
- "Thermal conductivity of a polymide film between 4.2 and 300 K, with and without alumina particles as filler"@en
- "THERMAL CONDUCTIVITY OF A POLYMIDE FILM BETWEEN 4.2 AND 300 K, WITH AND WITHOUT ALUMINA PARTICLES AS FILLER"@en