Linked Data Explorerhttp://worldcat.org/entity/work/id/308978464
Silicon run. II
Follows the manufacturing process by which IC wafers are made into chips used in microcomputers and multichip units of high-end computers. Illustrates back-end manufacturing from testing through packaging, PC board design and assembly, systems assembly, computer structure, and multichip technology.
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http://schema.org/about
- http://id.worldcat.org/fast/1019653
- http://id.loc.gov/authorities/subjects/sh85029495
- http://id.worldcat.org/fast/975545
- http://id.loc.gov/authorities/subjects/sh85084804
- http://id.loc.gov/authorities/subjects/sh85029476
- http://id.worldcat.org/fast/872701
- http://id.worldcat.org/fast/872078
- http://id.loc.gov/authorities/subjects/sh85067118
http://schema.org/alternateName
- "Silicon run two"@en
http://schema.org/contributor
- http://viaf.org/viaf/157365449
- http://id.loc.gov/authorities/names/n79005681
- http://id.loc.gov/authorities/names/n80073817
- http://id.loc.gov/authorities/names/n84040978
- http://experiment.worldcat.org/entity/work/data/308978464#Organization/stanford_university_department_of_electrical_engineering_center_for_integrated_systems
- http://experiment.worldcat.org/entity/work/data/308978464#Organization/intel_foundation
- http://viaf.org/viaf/124850326
- http://id.loc.gov/authorities/names/nr98037098
- http://viaf.org/viaf/139552688
- http://id.loc.gov/authorities/names/n79066217
- http://viaf.org/viaf/130639840
- http://viaf.org/viaf/154701873
- http://worldcat.org/entity/person/id/2640536554
http://schema.org/description
- "Follows the manufacturing process by which IC wafers are made into chips used in microcomputers and multichip units of high-end computers. Illustrates back-end manufacturing from testing through packaging, PC board design and assembly, systems assembly, computer structure, and multichip technology."@en
- "From fabricated wafers, through testing, packaging and assembly live industrial footage and animation show how integrated circuits are used in today's computers. Includes the following topics: IC logic, CAD design, sorting and testing, packaging, PC board design and assembly, system assembly, software, computer structure, signal integrity and multichip technology."@en
http://schema.org/name
- "Silicon run. II"@en