. . "TECHNOLOGY & ENGINEERING / Mechanical" . . "Mise sous boîtier (électronique)" . . "TECHNOLOGY & ENGINEERING Electronics Microelectronics." . . "Integrated circuits Design and construction." . . "Integrated circuits / Design and construction." . . . . "Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models."@en . . . . . . . . . . "Market opportunities have driven a dramatic increase in the functionality of integrated circuits (ICs), placing greater demands on the performance and reliability of the IC package." . . "Characterization of Integrated Circuit Packaging Materials"@en . "Characterization of Integrated Circuit Packaging Materials" . "Livres électroniques" . . . . . . . . . . . . . . . "Characterization of Integrated Circuit Packaging Materials deals with the systems of materials that comprise IC packages. Chapters in this volume address important characteristics of IC packages. It demonstrates analytical techniques appropriate for IC package characterization through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. This book discusses issues which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board, and multi-chip models." . . . . . . . . . "Characterization of integrated circuit packaging materials"@en . "Characterization of integrated circuit packaging materials" . "Electronic books"@en . . "Electronic books" . . . . . . "Componenti elettronici - Assemblaggio - Materiali." . . "Mise sous boîtier (Électronique) Matériaux." . . "TECHNOLOGY & ENGINEERING Electronics Digital." . . "Electronic packaging Materials." . . "Electronic packaging / Materials." . "Circuiti integrati - Progettazione e costruzione." . . "Circuits intégrés Conception et construction." . .