Linked Data Explorerhttp://worldcat.org/entity/work/id/497212774
Silicon Wafer Bonding Technology for VLSI and MEMS Applications
The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process.
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http://schema.org/about
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http://schema.org/description
- "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process"
- "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process."
- "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process."@en
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http://schema.org/name
- "Silicon Wafer Bonding Technology for VLSI and MEMS Applications"
- "Silicon Wafer Bonding Technology for VLSI and MEMS Applications"@en
- "Silicon wafer bonding technology : for VLSI and MEMS applications"@en
- "Silicon wafer bonding technology : for VLSI and MEMS applications"
- "Silicon wafer bonding technology for VLSI and MEMS applications"@en
- "Silicon wafer bonding technology for VLSI and MEMS applications"
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