<http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integrats_a_molt_gran_escala> <http://schema.org/name> "Circuits integrats a molt gran escala." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integrats_a_molt_gran_escala> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/technologie_silicium_sur_isolant> <http://schema.org/name> "Technologie silicium sur isolant." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/technologie_silicium_sur_isolant> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/sistemes_microelectromecanics> <http://schema.org/name> "Sistemes microelectromecànics." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/sistemes_microelectromecanics> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_emis_group> <http://schema.org/name> "INSPEC. EMIS Group." .
<http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_emis_group> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Organization> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator> <http://schema.org/name> "silicon-on-insulator." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon> <http://schema.org/name> "Silicon." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon> <http://schema.org/name> "silicon." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanical_devices> <http://schema.org/name> "micromechanical devices." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanical_devices> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/semiconductor_wafers> <http://schema.org/name> "Semiconductor wafers." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/semiconductor_wafers> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer_bonding> <http://schema.org/name> "wafer bonding." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer_bonding> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/vlsi> <http://schema.org/name> "VLSI." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/vlsi> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_information_service_emis_group> <http://schema.org/name> "INSPEC (Information service). EMIS Group." .
<http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_information_service_emis_group> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Organization> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/elemental_semiconductors> <http://schema.org/name> "elemental semiconductors." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/elemental_semiconductors> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonding> <http://schema.org/name> "Bonding." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonding> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonding> <http://schema.org/name> "Bonding" .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/polishing> <http://schema.org/name> "polishing." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/polishing> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonden> <http://schema.org/name> "Bonden." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonden> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/electric_resistance> <http://schema.org/name> "Electric resistance." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/electric_resistance> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium_sur_isolant> <http://schema.org/name> "Silicium sur isolant." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium_sur_isolant> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integres_a_tres_grande_echelle> <http://schema.org/name> "Circuits intégrés à très grande échelle." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integres_a_tres_grande_echelle> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774.nt> <http://rdfs.org/ns/void#inDataset> <http://purl.oclc.org/dataset/WorldCat/Works> .
<http://experiment.worldcat.org/entity/work/data/497212774.nt> <http://schema.org/about> <http://worldcat.org/entity/work/id/497212774> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium> <http://schema.org/name> "Silicium." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator_technology> <http://schema.org/name> "Silicon-on-insulator technology." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator_technology> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/integrated_circuits_very_large_scale_integration> <http://schema.org/name> "Integrated circuits--Very large scale integration." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/integrated_circuits_very_large_scale_integration> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/integrated_circuits_very_large_scale_integration> <http://schema.org/name> "Integrated circuits Very large scale integration." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/integrated_circuits_very_large_scale_integration> <http://schema.org/name> "Integrated circuits--Very large scale integration" .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanics> <http://schema.org/name> "Micromechanics." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanics> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/grinding_and_polishing> <http://schema.org/name> "Grinding and polishing." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/grinding_and_polishing> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer> <http://schema.org/name> "Wafer." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/761974209> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/862023530> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/907439271> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://worldcat.org/entity/person/id/2636121172> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/description> "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process" .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85057370> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://viaf.org/viaf/137135158> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/vlsi> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://viaf.org/viaf/157172367> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/248126145> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://id.loc.gov/authorities/names/n79063901> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/elemental_semiconductors> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon Wafer Bonding Technology for VLSI and MEMS Applications"@en .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonden> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/1118631> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/491500105> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon Wafer Bonding Technology for VLSI and MEMS Applications" .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integres_a_tres_grande_echelle> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/975566> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/824360903> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/microsystemes_electromecaniques> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/838910344> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/grinding_and_polishing> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/225941079> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/systemes_microelectromecaniques> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanical_devices> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://worldcat.org/entity/person/id/2723850256> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85067121> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/975602> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/861528049> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/polishing> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer_bonding> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon wafer bonding technology : for VLSI and MEMS applications"@en .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon wafer bonding technology : for VLSI and MEMS applications" .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh97007351> .
<http://worldcat.org/entity/work/id/497212774> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/CreativeWork> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_emis_group> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/776451913> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://viaf.org/viaf/137645277> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/905870> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/electric_resistance> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/integrated_circuits_very_large_scale_integration> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://id.loc.gov/authorities/names/no2006040878> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85122512> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://id.loc.gov/authorities/names/n85179411> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/1112189> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium_sur_isolant> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85041986> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85119902> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://experiment.worldcat.org/entity/work/data/497212774#Organization/inspec_information_service_emis_group> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/1019745> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/bonding> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://worldcat.org/entity/person/id/2641903354> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/semiconductor_wafers> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/1019892> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/wafer> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/865235869> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/sistemes_microelectromecanics> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85067125> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/technologie_silicium_sur_isolant> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/861767032> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/947952> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon wafer bonding technology for VLSI and MEMS applications" .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/name> "Silicon wafer bonding technology for VLSI and MEMS applications"@en .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85084861> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/contributor> <http://viaf.org/viaf/140242994> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.worldcat.org/fast/1118704> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/creator> <http://worldcat.org/entity/person/id/2723850256> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/circuits_integrats_a_molt_gran_escala> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicium> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/genre> "Electronic books"@en .
<http://worldcat.org/entity/work/id/497212774> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Book> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/mikromechanik> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh89003063> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/48026089> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon_on_insulator_technology> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/silicon> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/632794577> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/description> "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process."@en .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/description> "The book covers the following topics: wafer bonding principles; polish SOI; high volume production of SOI wafer; ELTRAN technology; wafer characterisation; advanced applications; and Si on Si wafer bonding process." .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/workExample> <http://www.worldcat.org/oclc/875267465> .
<http://worldcat.org/entity/work/id/497212774> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/497212774#Topic/micromechanics> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/systemes_microelectromecaniques> <http://schema.org/name> "Systèmes microélectromécaniques." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/systemes_microelectromecaniques> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/microsystemes_electromecaniques> <http://schema.org/name> "Microsystèmes électromécaniques." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/microsystemes_electromecaniques> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/mikromechanik> <http://schema.org/name> "Mikromechanik." .
<http://experiment.worldcat.org/entity/work/data/497212774#Topic/mikromechanik> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .