<http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique_analyse_thermique> <http://schema.org/name> "Mise sous boîtier (électronique) Analyse thermique." .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique_analyse_thermique> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique> <http://schema.org/name> "Mise sous boîtier (électronique)" .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/gedruckte_schaltung> <http://schema.org/name> "Gedruckte Schaltung." .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/gedruckte_schaltung> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/elektronisches_bauelement> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/workExample> <http://www.worldcat.org/oclc/39027908> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/werkstoff> .
<http://worldcat.org/entity/work/id/589995> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/CreativeWork> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://id.worldcat.org/fast/907414> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/konstruktion> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://id.loc.gov/authorities/subjects/sh85042366> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/name> "Electronic packaging : design, materials, process, and reliability" .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/workExample> <http://www.worldcat.org/oclc/246214213> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/mise_sous_boitier_electronique_analyse_thermique> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/contributor> <http://worldcat.org/entity/person/id/2630243841> .
<http://worldcat.org/entity/work/id/589995> <http://schema.org/about> <http://experiment.worldcat.org/entity/work/data/589995#Topic/gedruckte_schaltung> .
<http://experiment.worldcat.org/entity/work/data/589995.nt> <http://rdfs.org/ns/void#inDataset> <http://purl.oclc.org/dataset/WorldCat/Works> .
<http://experiment.worldcat.org/entity/work/data/589995.nt> <http://schema.org/about> <http://worldcat.org/entity/work/id/589995> .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/werkstoff> <http://schema.org/name> "Werkstoff." .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/werkstoff> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/konstruktion> <http://schema.org/name> "Konstruktion." .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/konstruktion> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/elektronisches_bauelement> <http://schema.org/name> "Elektronisches Bauelement." .
<http://experiment.worldcat.org/entity/work/data/589995#Topic/elektronisches_bauelement> <http://www.w3.org/1999/02/22-rdf-syntax-ns#type> <http://schema.org/Topic> .