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http://worldcat.org/entity/work/id/679260365

Advanced electronic packaging with emphasis on multichip modules

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about

contributor

description

http://schema.org/description

  • "An excellent desk reference for practicing engineers or an ideal text for students in interdisciplinary engineering classes, this comprehensive book discusses all aspects of the sciences and technologies involved in the packaging of integrated circuits, specifically, multichip modules (MCMs). In addition, you will find industrial case studies for several MCM technologies along with an assessment of design trade-offs. Also addressed are the critical role of economics and future trends in electronic packaging."
  • ""As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department."--Publisher's website."

editor

genre

http://schema.org/genre

  • "Ressources Internet"
  • "Electronic books"@en

name

http://schema.org/name

  • "Advanced electronic packaging : with emphasis on multichip modules"
  • "Advanced electronic packaging with emphasis on multichip modules"@en
  • "Advanced electronic packaging with emphasis on multichip modules"
  • "Advanced Electronic Packaging / edited by Richard K. Ulrich, William D. Brown"
  • "Advanced electronic packaging"@en
  • "Advanced electronic packaging"

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