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Area array packaging processes for BGA, Flip Chip, and CSP
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- http://id.worldcat.org/fast/1028806
- http://id.loc.gov/authorities/subjects/sh2002007737
- http://id.loc.gov/authorities/subjects/sh85084821
- http://id.worldcat.org/fast/825835
- http://id.worldcat.org/fast/1019751
- http://id.loc.gov/authorities/subjects/sh94006999
- http://id.worldcat.org/fast/906847
- http://id.loc.gov/authorities/subjects/sh92002333
http://schema.org/name
- "Area array packaging processes : for BGA, Flip Chip, and CSP"
- "Area array packaging processes : for BGA, Flip Chip and CSP"
- "Area array packaging processes for BGA, Flip Chip, and CSP"@en