Kelvin probe force microscopy measuring and compensating electrostatic forces
In the nearly 20 years of Kelvin probe force microscopy an increasing interest in the technique and its applications has developed. This book gives a concise introduction into the method and describes various experimental techniques. Surface potential studies on semiconductor materials, nanostructures and devices are described, as well as application to molecular and organic materials. The current state of surface potential at the atomic scale is also considered. This book presents an excellent introduction for the newcomer to this field, as much as a valuable resource for the expert.
"In the nearly 20 years of Kelvin probe force microscopy an increasing interest in the technique and its applications has developed. This book gives a concise introduction into the method and describes various experimental techniques. Surface potential studies on semiconductor materials, nanostructures and devices are described, as well as application to molecular and organic materials. The current state of surface potential at the atomic scale is also considered. This book presents an excellent introduction for the newcomer to this field, as much as a valuable resource for the expert."@en
"In the nearly 20 years of Kelvin probe force microscopy an increasing interest in the technique and its applications has developed. This book gives a concise introduction into the method and describes various experimental techniques. Surface potential studies on semiconductor materials, nanostructures and devices are described, as well as application to molecular and organic materials. The current state of surface potential at the atomic scale is also considered. This book presents an excellent introduction for the newcomer to this field, as much as a valuable resource for the expert."
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
Engineering Thermodynamics, Heat and Mass Transfer
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.
This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.