A wafer chuck for use between -196 and 350°C

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"A wafer chuck for use between - 196 and 350" C"
"A wafer chuck for use between -196 and 350C"
"A wafer chuck for use between -196 and 350°C"@en
"A wafer chuck for use between -196 and 350°C"
"A Wafer Chuck for use between -196 and 350 degrees c"@en
"A Wafer chuck for use between 196 and 350° C"
"A wafer chuck for use between -196 and 350 C : [by] R.Y. Koyama and M.G. Buehler"@en

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Center for Electronics and Electrical Engineering (U.S.). Electron Devices Division.

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"Center for Electronics and Electrical Engineering (U.S.). Electron Devices Division."

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United States. Defense Advanced Research Projects Agency.

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United States. Division of Electric Energy Systems.

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"United States. Division of Electric Energy Systems."

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Microélectronique.

This is a placeholder reference for a Topic entity, related to a WorldCat Entity. Over time, these references will be replaced with persistent URIs to VIAF, FAST, WorldCat, and other Linked Data resources.

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"Microélectronique."

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Semiconducteurs.

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"Semiconducteurs."

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Semiconductor wafers.

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"Semiconductor wafers."